xMEMS 量产 XMC-2400 与 XMC-4800 固态散热芯片,面向 AI 眼镜、手机和数据中心
xMEMS Labs 已开始量产 XMC-2400 和 XMC-4800 两款固态主动散热芯片,用硅膜振动驱动气流,无任何旋转部件。测试客户在眼镜、手机和 SSD 上实现芯片与系统级降温 10 至 25 摄氏度;XMC-2400 尺寸 7.42×9.48×1.13 毫米,约 150 毫瓦功耗下最高每秒 28 立方厘米风量,XMC-4800 达 48 立方厘米。首批基于 XMC-2400 的商用产品预计 2027 年初上市。
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