NVIDIA announces expansion of AI infrastructure capacity with supply chain partners
On October 21, 2026, NVIDIA announced at GTC Berlin the expansion of global manufacturing capacity with supply chain partners including Amkor, IBIDEN, KYEC, Samsung Electro-Mechanics, SPIL and Unimicron. According to information released by NVIDIA Newsroom that day, it plans to increase substrate capacity 2.5 times over the next three years; Amkor plans to increase advanced packaging capacity by more than 300% by the end of 2028; NVIDIA is providing KYEC with a $1.1 billion capacity reservation prepayment to support its new test facility in the United States, targeting mass production in April 2027; SPIL plans to increase co-packaged optics optical engine capacity 15 times by mid-2027 and seeks to double it again by the end of 2028. The Elec reported on October 22 that the agreements with Ibiden, Samsung Electro-Mechanics and Unimicron will expand semiconductor packaging substrate capacity 2.5 times over the next three years, and that Ibiden's Ono plant in Japan will triple its capacity and reach full production in the first quarter of 2028; the report also said NVIDIA prepaid KYEC $1.1 billion, doubling its total test capacity in 2027 compared with 2026. There are currently no facts of subsequent progress.
On October 21, 2026, NVIDIA announced at GTC Berlin the expansion of global manufacturing capacity with supply chain partners including Amkor, IBIDEN, KYEC, Samsung Electro-Mechanics, SPIL and Unimicron. According to information released by NVIDIA Newsroom that day, it plans to increase substrate capacity 2.5 times over the next three years; Amkor plans to increase advanced packaging capacity by more than 300% by the end of 2028; NVIDIA is providing KYEC with a $1.1 billion capacity reservation
Matched fieldsTitle