Houmo AI completes a Series B funding round of several billion yuan

Nov 4

1. 17:54

   Semiconductor Industry Observer

   Houmo AI Completes Several-Billion-Yuan Series B Funding; M50 Chip Has Secured Over 150 Product Design Wins

   Compute-in-memory AI chip company Houmo AI has completed a Series B funding round of several billion yuan, with the funds to be used to expand large-scale delivery of the M50 and advance R&D on the M6X and next-generation 3D CIM. The company disclosed that the M50, less than a year into mass production, has already secured more than 150 product design wins and serves more than 100 customers, covering four directions: Agent Computer, intelligent mobile terminals, embodied robots, and edge inference. The M50 offers 160 TOPS@INT8 of compute, 150 GB/s of memory bandwidth, and typical power consumption of 10W; its first 3D CIM chip, the A20, has entered production, and the M6X is under development.

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2. 13:30

   Shanghai Observer

   Houmo AI Completes Several-Billion-Yuan Series B Funding; M50 Chip Wins Over 100 Customers

   Houmo AI, a compute-in-memory AI chip company, recently completed a Series B funding round of several billion yuan. The funds will be used to expand large-scale delivery of the M50 and advance R&D on the M6X and next-generation 3D CIM products. The company disclosed that in less than a year of mass production, the M50 has already secured more than 150 product design wins and served over 100 customers, covering four directions: agent computers, intelligent mobile terminals, embodied robots, and edge inference. The M50 offers 160 TOPS@INT8 of compute, 150 GB/s of memory bandwidth, and typical power consumption of 10W. Its first 3D CIM chip, the A20, has already entered production.

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3. 13:04

   ZhidxRelated discussion

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   This post contributes to heat; it is not a formal report or confirmed fact.

4. 10:21

   Leiphone

   Houmo AI Completes Several-Billion-Yuan Series B Funding; M50 Chip Has Secured Over 150 Product Design Wins

   According to informed sources, compute-in-memory AI chip company Houmo AI recently completed a Series B funding round of several billion yuan, with the funds to be used to expand large-scale delivery of the M50 and advance R&D on the M6X and the next-generation 3D CIM. The company disclosed that in less than a year of mass production, the M50 has secured more than 150 product design wins and serves over 100 customers, covering four directions: Agent Computer, intelligent mobile terminals, embodied robots, and edge inference. The M50 offers 160 TOPS@INT8 of compute, 150 GB/s of memory bandwidth, and typical power consumption of 10W; complete systems such as the Lenovo AI Host P7 preview edition have adopted it for local large-model inference.

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