←Story detail

Trending story

Xpeedic Releases EDA2027 Version

2 reports2 story updatesUpdated Nov 2 17:07

Understand this story

AI overview

On October 30, 2026, Xpeedic released the EDA2027 version at the 2026 User Ecosystem Conference, adding 3DIC PDK and an optoelectronic co-simulation platform, and launched the Agentic AI super-intelligent agent platform AgentEvo and the trusted physical intelligence foundation XAI, driving AI for EDA from single-point functions toward platformization. The conference centered on STCO (chip-to-system collaborative optimization) and system-level EDA, emphasizing that chips, packaging, boards and racks must collaboratively address multi-physics issues such as electrical, thermal, mechanical and optical problems in the early design stage. A live demonstration of EDA Agent 2.0, jointly built by Lenovo and Xpeedic, showed that design iteration efficiency improved by about 5 times and manual operations were reduced by about 90%. According to a report by 21ic Electronics Network, more than a thousand representatives from industry chain enterprises and universities attended the conference.

AI-generated from public reports

Latest development · Report

Xpeedic releases EDA 2027 version, 2026 User Ecosystem Conference focuses on STCO and AI for EDA

Developments

1 confirmed developments

  1. Xpeedic Semiconductor releases EDA 2027 version

    Source:Jiwei.com

Reports and discussion timeline

Browse reports and discussion by time. Their evidence levels remain distinct.

Nov 2

  1. Jiwei.com

    Xpeedic releases EDA 2027 version, 2026 User Ecosystem Conference focuses on STCO and AI for EDA

    At the 2026 User Ecosystem Conference, Xpeedic released the EDA 2027 version, adding a 3DIC PDK and a co-simulation platform for optics and electronics, and launched the Agentic AI super-intelligent agent platform AgentEvo and the trustworthy physical intelligence foundation XAI, driving AI for EDA from single-point functions toward platformization. A live demonstration of EDA Agent 2.0, jointly built by Lenovo and Xpeedic, showed that design iteration efficiency improved by about 5 times and manual operations were reduced by about 90%. The conference also held discussions around STCO (chip-to-system co-optimization), emphasizing that chips, packaging, boards and racks need to collaboratively address multi-physics issues such as electrical, thermal, mechanical and optical problems in the early design stage.

Oct 31

  1. 21ic Electronic Network

    Xpeedic Releases EDA 2027 Version, STCO and AI for EDA Become the Focus of the 2026 User Ecosystem Conference

    Xpeedic released the EDA 2027 version at the 2026 User Ecosystem Conference, adding a 3DIC PDK and a photonic-electronic co-simulation platform, and launched the Agentic AI super intelligent agent platform AgentEvo and the Physics AI trustworthy physical intelligence foundation XAI. A live demonstration of EDA Agent 2.0, jointly built by Lenovo and Xpeedic, showed that design iteration efficiency improved by about 5 times and manual operations were reduced by about 90%. The conference centered on STCO (chip-to-system co-optimization) and system-level EDA, with more than a thousand representatives from industry chain companies and universities attending.

Related stories

  1. Related storiesTencent Maps unveils its full Agent capability landscape
  2. Related storiesAlibaba Cloud Releases AI Investment Research Workbench Qovest
  3. Related storiesKarpathy builds HackerTube with Claude Opus 5.5 in two hours
  4. Related storiesOpenAI announces that ChatGPT and Codex will share a single token allowance