AI demand drives silicon wafer pull-in beyond expectations; GlobalWafers, Formosa Sumco, and Wafer Works new order quotes "set to rise"
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AI is driving strong demand for advanced processes, and silicon wafer customers' pull-in momentum is better than expected. Goods originally scheduled to be fully pulled in by the end of this year have already been pulled in early, and some orders originally scheduled for shipment in early 2027 have also been pulled in a quarter ahead. Quotes for newly received orders are "set to rise." GlobalWafers, Formosa Sumco, and Wafer Works are negotiating new contract prices with customers, all pointing in the same direction of price increases, and are expected to usher in the first wave of price hikes in more than three years. GlobalWafers Chairwoman Doris Hsu forecast a significant increase in revenue next year, is optimistic about spot price increases in the second half of this year and the first quarter of next year, and expects long-term contract prepayments to increase significantly in the first half of next year.
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半导体硅晶圆市场春燕提前报到。厂商透露，AI推动先进制程需求强劲，硅晶圆市况比预期强，现阶段客户拉货力道优于预期，原定今年底拉完的货现在已提前拉完，部分原本要在2027年初出货的订单也提早一季开始拉货，新接订单报价「涨定了」。
随着硅晶圆市况复苏动能优于预期，环球晶、台胜科、合晶等台系厂商运营同步热转。
据了解，硅晶圆厂商正陆续与客户端洽谈新单的合约价，进度不一，但不约而同地往涨价方向前进，可望迎接三年多来首见涨价潮。即便单一厂商均不对外透露目前长约签订状况，但都正努力增加长约所占比重。硅晶圆厂高层私下也有信心，认为明年价格一定会比今年好。市场认为，随着订单需求强劲，伴随报价上涨助威，环球晶、台胜科、合晶后市运营可期。
环球晶董事长徐秀兰预告，明年将迎来营收显著提高的一年，看好今年下半年与明年首季硅晶圆现货价可望上涨，环球晶明年上半年就会开始出现长约预付款显著增加的状况。
国际半导体产业协会（SEMI）先前预估，全球半导体材料市场今、明年都将呈现两位数百分比增长，徐秀兰看好，硅晶圆方面有很高可能也将迎来大幅增长，主因客户都在大规模扩厂，即使是还没有扩厂之前的旧厂，也投入去瓶颈工作，因为要能缩短时间，提早增加出货量。
徐秀兰研判，未来两年全球硅晶圆产业增长两位数百分比值得期待，主要动能来自于两个面向，一是报价持续调高，二是出货量增加。也就是量价两大指标同步上扬。
台胜科也乐观预期，今年下半年业绩可望优于上半年，持续满足客户需求，对运营抱持乐观态度。
合晶积极与客户洽谈调整硅晶圆报价，并调整产品组合，朝利润更好的应用迈进，除了深化既有硅晶圆产品，同步聚焦先进封装与光传输等高成长应用领域，并与全球龙头晶圆代工客户高度合作。
近期方形晶圆已完成送样，客户验证进度顺利，且积极参与结构补偿裸片项目开发，扩大先进封装产品组合。